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Acid copper Plating Intermedia
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UPS Acid copper Plating Intermediate

UPS

Chemical Name: 3-S-Isothiuronium propane sulfonate Molecular formula:C4H10N2O3S2
Molecular weight: 198.2 CAS NO. 21668-81-5



1) Quality Standards: Q/LZ 41-2008
Appearance: white powder.
Assay: min 95.0%
Solubility: 50%l soluble in water(Slightly soluble in alcohol)
Secondary component: 3-hydroxy-propane -1-sulfonic acid
Melting point: 246℃
2) Application
Concentration in the bath: 0-100 mg/L
Usage: Used for deposition of bright, ductile copper coatings in combination with polyethylene glycols and non-ionic surfactants. Also can be used in acid electroplating baths for silver and palladium deposition.