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Acid copper Plating Intermedia
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EDTP(Q75) Acid copper Plating Intermediate

EDTP(Q75)

Chemical Name: N,N,N',N'-Tetrakis (2-hydroxypropyl) ethylenediamine Molecular formula: C14H32N2O4
Molecular weight: 292.42 CAS NO. 102-60-3


1) Quality Standards: Q/LZ 39-2008
Appearance: Colorless transparent liquid
Assay: min 75.0%
PH Value: 7.5-8.5
Density: 1.04-1.06
2) Application
Concentration in the bath: 10-30 mg/L
Usage: It is soluble in water, weakly alkaline aqueous solution. Mainly used for chemical copper complexing agent.